FYUZ Unpacked: Leaders Discuss The Big Shifts in Disaggregation

Recorded live at FYUZ, this Digitel Talk wrap-up brings together three industry powerhouses — Stéphane TéralGeoff Hollingworth, and Vishal Mathur — for a fast-paced, insightful conversation on how cloudification, AI, and open architectures are reshaping the telecoms landscape.

From the cultural challenges of transforming traditional telcos, to why openness is no longer optional, to the role of AI in driving network efficiency and innovation — this episode captures the energy, debates, and breakthroughs that defined FYUZ.

Whether you’re a network strategist, technologist, policymaker, or simply curious about where the industry is heading, this wrap-up distils the must-know insights from one of the sector’s most important events.

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Episode sponsored by IFG Consulting Europe– Supporting telcos with tech strategy, digitisation and growth.

Guests Bios:

Stéphane Téral is a leading telecom analyst with over 36 years of industry
experience, including nearly three decades in Silicon Valley. He specializes in next-
gen wireless infrastructure—5G, 6G, open RAN, cloud networking, and CSP digital
transformation—and advises global telecom providers, vendors, start-ups, and
investors on strategy, market opportunities, and M&A. A frequent keynote speaker
and media contributor, Stéphane is the founder of TÉRAL RESEARCH and has held
senior roles at LightCounting, IHS Markit, Infonetics Research, and RHK.

Geoff Hollingworth has been in the mobile communications industry for more than 30 years, beginning his career with Ericsson in 1991 and with 2G.  Throughout his journey in telecom and cloud, he’s been a software engineer and led research and development, business development, network rollouts, consulting, marketing campaigns and strategic communications for his teams.  

Vishal Mathur as Global Head of Engagement at Telecom Infra Project (TIP), is responsible for building a commercially sustainable operation with a broad and active member base, engaging globally with TIP members, industry stakeholders and policy makers to open opportunities for collaboration on R&D and commercial solution development within the area of advanced connectivity and AI.  

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